Fine copper particles and method for producing fine copper particles
AssigneesNisshin Seifun Group Inc., Nisshin Engineering Inc.
InventorsShu WATANABE, Shiori SUEYASU, Tokisada MORITA
Life of this patent
Estimating the term…
Abstract
There are provided copper fine particles applicable to die attach (die bonding) or the like and having excellent heat dissipation properties, as well as a method for producing the copper fine particles. The copper fine particles have a coating layer constituted of glycol or a glycol polymer. The glycol or the glycol polymer preferably has a molecular weight of 300 or less. The particle size measured by BET method is 20 to 400 nm.
Claims8
Copper fine particles having a coating layer constituted of glycol or a glycol polymer, the copper fine particles being present alone.
Copper fine particles having a coating layer constituted of glycol or a glycol polymer, the copper fine particles being present alone,
- wherein a removal percentage of the coating layer at a temperature of 200° C. measured by thermogravimetric and differential thermal analysis in a nitrogen atmosphere is 30 mass % or more,
- wherein a weight loss percentage at a temperature of 200° C. measured by thermogravimetric and differential thermal analysis in a nitrogen atmosphere is 0.25 mass % or more,
- wherein a weight increase percentage at a temperature of 200° C. measured by thermogravimetric and differential thermal analysis in an air atmosphere is 5 mass % or less, or
- wherein a particle growth rate in particle size based on BET method after the copper fine particles in a particulate form are heated at a temperature of 200° C. for 1 hour in a nitrogen atmosphere is 105% or more.
Copper fine particles having a coating layer constituted of glycol or a glycol polymer, the copper fine particles being present alone,
- wherein a volume resistivity after the copper fine particles in a pellet form are baked at a temperature of 200° C. for 1 hour in a nitrogen atmosphere is 1.0×10−4 Ω·cm or less, or
- wherein a volume contraction percentage after the copper fine particles in a pellet form are baked at a temperature of 200° C. for 1 hour in a nitrogen atmosphere is 20% or less.
Dependencies are inferred from the claim text.