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US 2026/0025923 A1Published application
Printed circuit board backdrill quality verification
AssigneeDell Products L.P.
InventorsChang-Kai Chu, Ching-Huei Chen, Vijendera Kumar, Bhyrav Mutnury
Life of this patent
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Abstract
A printed circuit board, comprising a via configured to provide electrical connectivity between layers of the printed circuit board and having at least a portion of the via backdrilled resulting in a backdrill hole. The printed circuit boar also includes a test coupon configured to determine whether the backdrill hole is according to a specification.
Claims20
A printed circuit board, comprising:
- a via configured to provide electrical connectivity between layers of the printed circuit board and having at least a portion of the via backdrilled resulting in a backdrill hole;
- and
- a test coupon configured to determine whether the backdrill hole is according to a specification.
An information handling system comprising:
- a printed circuit board comprising:
- a via configured to provide electrical connectivity between layers of the printed circuit board and having at least a portion of the via backdrilled resulting in a backdrill hole;
- and
- a test coupon configured to determine whether the backdrill hole is according to a specification.
1 more element
A method comprising:
- providing a printed circuit board comprising:
- a via providing electrical connectivity between layers of the printed circuit board and having at least a portion of the via backdrilled resulting in a backdrill hole;
- and
- a test coupon providing electrical communication for determining whether the backdrill hole is according to a specification.
1 more element
Dependencies are inferred from the claim text.