Pressure-sensitive adhesive tape, article, and method for dismantling article
AssigneeDIC Corporation
InventorsJunko Kanda, Takahiro Obi, Yusuke Takahashi
Life of this patent
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AssigneeDIC Corporation
InventorsJunko Kanda, Takahiro Obi, Yusuke Takahashi
Estimating the term…
[Object] To provide a pressure-sensitive adhesive tape that has a low volatile component content, has reduced adverse effects on the external environment, can be thermally detached within a short period of time and can prevent thermal damage to the adherend, and allows for easy thermal detachment procedures; an article in which at least two adherends are bonded via the pressure-sensitive adhesive tape; and a method for dismantling the article. [Solution] A pressure-sensitive adhesive tape including a pressure-sensitive adhesive layer, a heating element, and a melt-softening layer that is adjacent to the heating element at least in this order, in which the melt-softening layer contains a thermoplastic resin having a weight average molecular weight of 80,000 to 150,000 and a tackifying resin having a mass loss rate of 3% or less when heating from 25° C. to 200° C. at a temperature raising rate of 10° C./min in nitrogen.
A pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer, a heating element, and a melt-softening layer that is adjacent to the heating element at least in this order, wherein the melt-softening layer contains a thermoplastic resin having a weight average molecular weight of 80,000 to 150,000 and a tackifying resin having a mass loss rate of 3% or less when heating from 25° C. to 200° C. at a temperature raising rate of 10° C./min in nitrogen.
Dependencies are inferred from the claim text.