Resin composition and article made therefrom
AssigneeElite Material Co., Ltd.
InventorChen-Yu HSIEH
Life of this patent
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Abstract
A resin composition includes 100 parts by weight of a vinyl group-containing resin and 35 parts by weight to 65 parts by weight of a phosphorus-containing compound of Formula (1). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion.
Claims12
A resin composition comprising 100 parts by weight of a vinyl group-containing resin and 35 parts by weight to 65 parts by weight of a phosphorus-containing compound, wherein the phosphorus-containing compound has a structure of Formula (1):
- in Formula (1), R1 to R6 are each independently hydrogen or a C1 to C3 alkyl group, Q1 are each independently a —(C═O)— group or a *—CH2—C6H4— group, wherein * indicates bonding to oxygen atom, and each G is independently a monovalent phosphorus-containing group represented by Formula (2) or Formula (3);
- in Formula (2), n1 and n2 are each independently an integer of 0 to 3, and R7 and R8 are each independently a C1 to C3 alkyl group.
Dependencies are inferred from the claim text.