Semiconductor structure and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJHENG-HONG JIANG, SHING-HUANG WU, CHIA-WEI LIU
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Abstract
A semiconductor structure includes a substrate, a fixed member disposed on the substrate, a floating member connected to the fixed member, and a buffering structure disposed in the floating member. The floating member is separated from the substrate. The floating member includes a first conductive layer and a second conductive layer over the first conductive layer. The buffering structure includes a soft material layer and an air gap surrounded by the soft material layer. The second conductive layer is separated from the air gap.
Claims20
A semiconductor structure, comprising:
- a substrate;
- a fixed member disposed on the substrate;
- a floating member, connected to the fixed member and separated from the substrate, wherein the floating member comprises a first conductive layer and a second conductive layer over the first conductive layer;
- and
- a buffering structure, disposed in the floating member and including a soft material layer and an air gap surrounded by the soft material layer,
- wherein the second conductive layer is separated from the air gap.
A structure of a micro-electro-mechanical system (MEMS), comprising:
- a substrate;
- an interdigital electrode, disposed over the substrate and including a plurality of branch portions, wherein the branch portions are separated from the substrate;
- and
- a soft structure, disposed in at least one of the branch portions and including a plurality of protruding portions along a first direction substantially perpendicular to the substrate, wherein the soft structure includes an air gap in at least one of the protruding portions.
A method of manufacturing a semiconductor structure, comprising:
- forming a first conductive layer over a sacrificial layer;
- forming a first trench and a second trench in the first conductive layer, wherein the second trench is different from the first trench;
- forming a soft material layer to seal the first trench to form a first air gap and to fill the second trench;
- forming a second conductive layer over the soft material layer;
- and
- removing the sacrificial layer.
Dependencies are inferred from the claim text.