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US 2026/0020337 A1Published application
Integrated circuit semiconductor element having heterogeneous gate structures and method of fabricating integrated circuit semiconductor element
AssigneeSamsung Electronics Co., Ltd.
InventorsKyungsoo Kim, Kyenhee Lee
Life of this patent
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Abstract
An integrated circuit semiconductor element includes: a substrate; a complementary field effect transistor (FET) (cFET) formed over the substrate and having a quadruple-gate structure, in which nano sheet stacked structures are sequentially stacked; and a planar FET having a mono-gate structure or a zebra fin FET (ZE FINFET) having a triple-gate structure, which are formed over the substrate.
Claims20
An integrated circuit semiconductor element comprising:
- a substrate;
- a complementary field effect transistor (cFET) formed over the substrate and having a quadruple-gate structure, in which nano sheet stacked structures are sequentially stacked;
- and
- a zebra fin FET (ZE FINFET) comprising a plurality of semiconductor layers and having a triple-gate structure, which are formed over the substrate,
- wherein the cFET comprises transistors of different conductivity types stacked alternately in a vertical direction.
2 more elements
An integrated circuit semiconductor element comprising:
- a substrate;
- a complementary field effect transistor (cFET) formed over the substrate and having a quadruple-gate structure in which nano sheet stacked structures are sequentially stacked;
- and
- a zebra fin FET (ZE FINFET) formed over the substrate, comprising a plurality of semiconductor layers and having a triple-gate structure, and spaced apart from the cFET in a first direction parallel to a surface of the substrate,
- wherein the cFET comprises a first active fin formed on the substrate, the nano sheet stacked structures formed over the first active fin, a first dielectric layer surrounding the nano sheet stacked structures, and a first gate electrode formed on the first dielectric layer,
- wherein the ZE FINFET comprises a second active fin formed on the substrate, a second dielectric layer surrounding the second active fin, and a second gate electrode formed on the second dielectric layer,
- wherein an upper surface of the second active fin is at a higher level than an upper surface of the first active fin in a second direction perpendicular to the surface of the substrate,
- wherein the second active fin has the plurality of semiconductor layers vertically spaced apart from each other, and
- wherein the cFET comprises transistors of different conductivity types stacked alternately in the second direction.
6 more elements
A method of fabricating an integrated circuit semiconductor element, the method comprising:
- preparing a substrate on which a first region and a second region are defined and spaced apart from each other in a first direction parallel to a surface of the substrate;
- forming a first active fin in the first region and a second active fin in the second region;
- forming nano sheet stacked structures, sequentially stacked in the first region;
- and
- forming a first gate electrode covering the first active fin, a second gate electrode covering the second active fin, a complementary field effect transistor (cFET) including the first active fin, and a zebra fin FET (ZE FINFET) including the second active fin,
- wherein, the first active fin extends in a second direction different from the first direction and parallel to the surface of the substrate and has a first height in the first region and the nano sheet stacked structures are formed over the first active fin,
- wherein, the second active fin extends in the second direction and has a second height in the second region,
- wherein, the cFET is formed by forming a first gate electrode having a quadruple-gate structure covering both side surfaces, an upper surface, and a lower surface of the nano sheet stacked structures in the first region,
- wherein, the ZE FINFET is formed by forming a second gate electrode having a triple-gate structure covering both side surfaces and an upper surface of the second active fin in the second region,
- wherein the second active fin comprises a zebra active pattern comprising a plurality of semiconductor layers vertically spaced apart from each other. and
- wherein the cFET comprises transistors of different conductivity types stacked alternately in the second direction.
8 more elements
Dependencies are inferred from the claim text.