Semiconductor device and method for manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsShuhei TATEMICHI, Tatsuya NAITO, Yasuhiko ONISHI
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AssigneeFuji Electric Co., Ltd.
InventorsShuhei TATEMICHI, Tatsuya NAITO, Yasuhiko ONISHI
Estimating the term…
Provided is a semiconductor device including a transistor portion and a diode portion, the semiconductor device including: a drift region of a first conductivity type provided in a semiconductor substrate; and trench portions extending in a predetermined trench extension direction, wherein the transistor portion has a base region of a second conductivity type, emitter regions of the first conductivity type discretely provided in a trench extension direction, each having a higher doping concentration than the drift region, a contact region of the second conductivity type having a higher doping concentration than the base region, a trench contact portion extending from a front surface of the semiconductor substrate in a depth direction, in a mesa portion between two adjacent trench portions, and a thinning region provided between two adjacent emitter regions in the trench extension direction, and having a lower doping concentration of the second conductivity type than the contact region.
A semiconductor device including a transistor portion and a diode portion, the semiconductor device comprising:
A method for manufacturing a semiconductor device including a transistor portion and a diode portion, the method for manufacturing a semiconductor device comprising:
Dependencies are inferred from the claim text.