Power conversion apparatus, and manufacturing method for power conversion apparatus
AssigneeHitachi Astemo, Ltd.
InventorsNaoya TOKOO, Toshiaki ISHII, Rinnosuke ODA
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Abstract
A power conversion apparatus includes: a semiconductor element; a heat exchanger plate connected to the semiconductor element; a semiconductor module formed by molding the semiconductor element and the heat exchanger plate with resin; a thermal conductive material having a semisolid shape that is disposed in contact with the heat exchanger plate and covering one surface of the semiconductor module; and a heat dissipation member that dissipates heat from the semiconductor module through the thermal conductive material.
Claims6
A power conversion apparatus comprising:
- a semiconductor element;
- a heat exchanger plate connected to the semiconductor element;
- a semiconductor module formed by molding the semiconductor element and the heat exchanger plate with resin;
- a thermal conductive material having a semisolid shape that is disposed in contact with the heat exchanger plate and covering one surface of the semiconductor module;
- and
- a heat dissipation member that dissipates heat from the semiconductor module through the thermal conductive material.
A manufacturing method for a power conversion apparatus, comprising:
- forming a semiconductor module by molding, with a resin, a semiconductor element and a heat exchanger plate connected to the semiconductor element;
- forming a stepped portion formed to expose a surface of the heat exchanger plate and surround the surface of the heat exchanger plate by removing a part of a mold resin of one surface of the semiconductor module having been formed;
- and
- assembling, to the semiconductor module, a thermal conductive material having a semisolid shape disposed in contact with an exposure surface of the heat exchanger plate and covering the mold resin on the one surface, and a heat dissipation member that dissipates heat from the semiconductor module via the thermal conductive material.
Dependencies are inferred from the claim text.