Heat dissipation apparatus and heat dissipation device
AssigneeBitmain Technologies Inc.
InventorsKetuan ZHAN, Zesen NIE, Hangkong HU, Mingliang HAO
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a heat dissipation apparatus for cooling a chipset, including: a sealed liquid cooling tank; a phase-change working medium infused in an interior of the liquid cooling tank; an exhaust port provided in an outer wall of the liquid cooling tank, and the liquid cooling tank is connectable with a sucking pump through the exhaust port; when the sucking pump extracts gas in the liquid cooling tank, air pressure in the liquid cooling tank is reduced from a first value to a second value. The heat dissipation apparatus disclosed in the present application can realize effective heat dissipation of heating devices at a low rated temperature.
Claims19
A heat dissipation apparatus for cooling a chipset, comprising:
- a sealed liquid cooling tank;
- a phase-change working medium, infused in an interior of the liquid cooling tank;
- an exhaust port, provided in an outer wall of the liquid cooling tank, and the liquid cooling tank is connectable with a sucking pump through the exhaust port;
- when the sucking pump extracts gas in the liquid cooling tank, air pressure in the liquid cooling tank is reduced from a first value to a second value.
Dependencies are inferred from the claim text.