Intelligent liquid cooling of electronic devices by actively controlled manifolds

A cooling system configured to cool a plurality of electronic devices, the cooling system comprising:

• a controller;
• an active inlet manifold comprising a plurality of spaced apart manifold outlets through which a cooling liquid can flow into proximity and thermal communication with the electronic devices;
• and
• an active outlet manifold comprising a plurality of spaced apart manifold inlets through which the cooling liquid can flow from proximity with the electronic devices into the active outlet manifold;
• wherein the active inlet manifold includes a first plurality of remotely adjustable flow control devices that separately control the flow of the cooling liquid through each of the plurality of manifold outlets, and the active outlet manifold includes a second plurality of remotely adjustable flow control devices that separately control the flow of the cooling liquid through each of the plurality of manifold inlets;
• and
• wherein the controller is configured to:
• at least one of detect and predict a local heat dissipation increase in a hotspot region of the electronic devices;
• and
• adjust the flow control devices of the active manifolds to cause more of the cooling liquid to flow in thermal communication with the hotspot region as compared to other regions proximate the electronic devices.