Electronic Device

Abstract

This application provides an electronic device, and relates to the field of electronic device technologies, to resolve a problem that an internal thickness space of the electronic device cannot meet a requirement of a minimum welding length between the spring plate and the metal portion. The electronic device includes a housing, a mainboard, and the spring plate. The housing includes a bezel and a back cover, and the back cover is fixedly connected to the bezel. The mainboard is disposed in the housing. The spring plate includes a welding portion and a contact portion, where the welding portion is bonded to and fixed, by welding, to the bezel, and the contact portion is electrically connected to the mainboard. The contact portion is parallel to the mainboard, an included angle a is formed between the welding portion and the contact portion, and the included angle a is an obtuse angle or an acute angle.

Dependencies are inferred from the claim text.