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US 2026/0020161 A1Published application
Wire harness
AssigneeYazaki Corporation
InventorsTatsuya Oga, Katsunori Sato, Mariko Nakagawa, Seigo Mochizuki
Life of this patent
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Abstract
A wire harness includes: a flexible printed circuit board; a chip fuse mounted on the flexible printed circuit board; a plate member having a flat plate-shaped plate body having a frame shape, and a cylindrical peripheral wall protruding from the plate body in a thickness direction of the plate body; and a potting agent, in which the plate body is fixed to the flexible printed circuit board so as to surround the chip fuse by the peripheral wall, and the potting agent is charged in a space portion surrounded by the peripheral wall and covers the chip fuse.
Claims4
A wire harness comprising:
- a flexible printed circuit board;
- a chip fuse mounted on the flexible printed circuit board;
- a plate member having a flat plate-shaped plate body having a frame shape, and a cylindrical peripheral wall protruding from the plate body in a thickness direction of the plate body;
- and
- a potting agent, wherein
- the plate body is fixed to the flexible printed circuit board so as to surround the chip fuse by the peripheral wall, and
- the potting agent is charged in a space portion surrounded by the peripheral wall and covers the chip fuse.
4 more elements
Dependencies are inferred from the claim text.