Electronic device and manufacturing method thereof

An electronic device comprising:

• a printed circuit board (PCB), wherein the PCB comprises a base layer and a first and a second electrode pads formed on the base layer;
• a multilayer ceramic capacitor mounted on the PCB;
• and
• an insulating layer between the PCB and the multilayer ceramic capacitor, wherein the insulating layer is in contact with the PCB and the multilayer ceramic capacitor, and
• wherein the multilayer ceramic capacitor comprises:
• a ceramic body comprising a plurality of internal electrodes alternately arranged with a plurality of dielectric layers;
• and
• a plurality of external electrodes on the ceramic body and electrically connected to the plurality of internal electrodes.

An electronic device comprising:

• a printed circuit board (PCB) wherein the PCB comprises a base layer and a first and a second electrode pads formed on the base layer,
• a multilayer ceramic capacitor mounted on the PCB;
• and
• an insulating layer between the PCB and the multilayer ceramic capacitor, wherein the insulating layer is in contact with the PCB and the multilayer ceramic capacitor, and
• wherein the multilayer ceramic capacitor comprising:
• a ceramic body comprising a plurality of first internal electrodes and a plurality of second internal electrodes alternately arranged with a plurality of dielectric layers;
• and
• a first external electrode and a second external electrode, on opposing faces of the ceramic body, wherein the first external electrode is electrically connected to the plurality of first internal electrodes, and the second external electrode is electrically connected to the plurality of second internal electrodes.