Liquid crystal polymer embedded microelectronics device
AssigneeLCP Medical Technologies, Inc.
InventorJames Rathburn
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Abstract
Embodiments described herein can include multi-layer circuits within a liquid crystal polymer (LCP) material to define a 3-D interconnect structure that connects the microelectronics features, devices, components and electrical interfaces. In addition, mechanical functions can be embedded in a fashion and proximity such that the embedded electronics can interface and interact with each other as well as introduced conditions relevant to the function of the device and the outside world or environment it is exposed to.
Claims12
A device comprising:
- a housing providing for a device, wherein the housing is composed of a liquid crystal polymer (LCP);
- and
- circuit components embedded in the housing.
A method of fabricating a structural component for a device, the method comprising:
- molding a structural component of a device from a liquid crystal polymer (LCP) material, the structural component providing physical support for a non-electronic portion of the device or acting as an exterior housing for the device;
- and
- embedding a circuit component in the LCP material.
A device comprising:
- liquid crystal polymer (LCP) material having two metal layers with a dielectric layer therebetween, wherein the two metal layers are coupled to a circuit and function as a capacitor for the circuit.
A device comprising:
- a liquid crystal polymer (LCP) material having a micro-electrode projecting outward therefrom and composed of a metal.
Dependencies are inferred from the claim text.