Wiring substrate
AssigneeIbiden Co., Ltd.
InventorMasatoshi KUNIEDA
Life of this patent
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Abstract
A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, and a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part positions an optical wiring part on the surface of the electrical wiring part.
Claims20
A wiring substrate, comprising:
- an electrical wiring part comprising an insulating layer and a conductor layer and having an optical wiring region and a component region;
- and
- a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part,
- wherein the component region of the electrical wiring part is configured to position a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part is configured to position an optical wiring part on the surface of the electrical wiring part.
Dependencies are inferred from the claim text.