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US 2026/0020146 A1Published application
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsTakashi YAMAMOTO, Ryosuke SASAOKA
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Abstract
A wiring circuit board includes a metal support layer, a first insulating layer, a terminal, and a heat dissipating layer. The first insulating layer is made of polyimide and has a water absorption rate of 0.40% or more. The heat dissipating layer is disposed on an opposite side to the terminal with respect to the first insulating layer, and is disposed between the metal support layer and the first insulating layer. The heat dissipating layer is in contact with both the metal support layer and the first insulating layer.
Claims6
A wiring circuit board comprising:
- a metal support layer;
- an insulating layer disposed on one side of the metal support layer in a thickness direction of the metal support layer, the insulating layer being made of polyimide, and the insulating layer having a water absorption rate of 0.40% or more;
- a terminal disposed on a one-side surface of the insulating layer in the thickness direction;
- and
- a heat dissipating layer disposed on an opposite side to the terminal with respect to the insulating layer in the thickness direction, the heat dissipating layer being disposed between the metal support layer and the insulating layer in the thickness direction, and the heat dissipating layer being in contact with both the metal support layer and the insulating layer.
2 more elements
Dependencies are inferred from the claim text.