Heat dissipation sheet, circuit board, and electronic device
AssigneeChipbond Technology Corporation
InventorsDong-Sheng Li, Yi Ling Hsieh, Pei-Ying Lee, San Lee
Life of this patent
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Abstract
The present disclosure provides a heat dissipation sheet to be adhered to a circuit board. The heat dissipation sheet includes a first adhesive layer to be adhered to the circuit board, a heat dissipation layer arranged over the first adhesive layer, a protection layer arranged over the heat dissipation layer, and a plurality of heat dissipation holes extending downward from an upper surface of the protection layer, wherein bottoms of the plurality of the heat dissipation holes are not lower than an upper surface of the first adhesive layer or a lower surface of the heat dissipation layer.
Claims15
A heat dissipation sheet to be adhered to a circuit board, the heat dissipation sheet comprising:
- a first adhesive layer, to be adhered to the circuit board;
- a heat dissipation layer, arranged over the first adhesive layer;
- a protection layer, arranged over the heat dissipation layer;
- and
- a plurality of heat dissipation holes, extending downward from an upper surface of the protection layer, wherein bottoms of the plurality of heat dissipation holes are not lower than an upper surface of the first adhesive layer.
Dependencies are inferred from the claim text.