Duct structures for cooling of memory system components

A memory system, comprising:

• a plurality of memory devices within a first portion of the memory system;
• circuitry configured to facilitate operations by the plurality of memory devices and within a second portion of the memory system, wherein the circuitry is configured to have a first operating temperature that is higher than a second operating temperature of the plurality of memory devices;
• one or more heat sinks coupled with the circuitry;
• and
• one or more physical ducts coupled with the one or more heat sinks and configured to move air from a region associated with a temperature that is less than the first operating temperature and the second operating temperature to the one or more heat sinks, wherein the one or more physical ducts are associated with a third portion of the memory system that is different from the first portion and the second portion.

A memory system, comprising:

• one or more printed circuit boards (PCBs);
• and
• a plurality of memory devices distributed across the one or more PCBs, wherein each PCB of the one or more PCBs comprises:
• one or more memory devices positioned within a first region of the PCB;
• circuitry associated with the one or more memory devices and positioned within a second region of the PCB, wherein a portion of the circuitry is associated with a first temperature characteristic that is greater than other temperature characteristics associated with the one or more memory devices;
• and
• one or more ducts coupled with the portion of the circuitry, wherein each duct extends from the portion of the circuitry to a fourth region that is external to the memory system and across a third region of the PCB that is different from the first region comprising the one or more memory devices and the second region comprising the circuitry.