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US 2026/0018533 A1Published application
Semiconductor Device and Method of Forming Embedded Magnetic Shielding
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsChangOh Kim, JinHee Jung, OMin Kwon
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Abstract
A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulant, and second encapsulant.
Claims25
A semiconductor device, comprising:
- a substrate;
- a semiconductor die disposed over the substrate;
- a first encapsulant deposited over the semiconductor die;
- a ferromagnetic film disposed over the first encapsulant;
- and
- a second encapsulant deposited over the ferromagnetic film, wherein side surfaces of the first encapsulant, second encapsulant, and ferromagnetic film are coplanar.
3 more elements
A semiconductor device, comprising:
- an electrical component;
- a first encapsulant deposited over the electrical component;
- a ferromagnetic film disposed over the first encapsulant;
- and
- a second encapsulant deposited over the ferromagnetic film, wherein side surfaces of the first encapsulant, second encapsulant, and ferromagnetic film are coplanar.
2 more elements
A semiconductor device, comprising:
- a substrate;
- a semiconductor die disposed over the substrate;
- an electrical component disposed over the substrate;
- a first encapsulant deposited over the semiconductor die and electrical component;
- a ferromagnetic film disposed over the first encapsulant with the electrical component outside a footprint of the ferromagnetic film;
- and
- a second encapsulant deposited over the ferromagnetic film, wherein side surfaces of the first encapsulant and second encapsulant are coplanar.
4 more elements
A semiconductor device, comprising:
- a first electrical component;
- a second electrical component;
- a first encapsulant deposited over the first electrical component and second electrical component;
- a ferromagnetic film disposed over the first encapsulant;
- and
- a second encapsulant deposited over the ferromagnetic film, wherein side surfaces of the first encapsulant and second encapsulant are coplanar.
3 more elements
Dependencies are inferred from the claim text.