Semiconductor package

A semiconductor package comprising:

• a package substrate;
• and
• a semiconductor chip,
• wherein the package substrate comprises:
• a wiring structure in which a wiring line is formed and on which the semiconductor chip is mounted;
• and
• a heat sink to which a heat radiation pattern configured to emit heat is formed, and
• wherein the wiring structure and the heat sink are integrally formed.

A semiconductor package comprising:

• a lower package substrate;
• an upper package substrate disposed on the lower package substrate in a first direction and to which a wiring structure including a wiring line is formed and a heat sink having a multilayer structure to which a plurality of heat radiation patterns is formed are integrally formed;
• a lower semiconductor device disposed on the lower package substrate and electrically connected to the lower package substrate;
• an upper semiconductor device disposed on the wiring structure and electrically connected with the wiring structure;
• a conductive structure disposed between the wiring structure and the lower package substrate and electrically connected to the wiring structure and the lower package substrate;
• a mold film surrounding the wiring structure and the lower semiconductor device;
• and
• an insulation film surrounding the wiring line and the heat radiation patterns,
• wherein the lower semiconductor device is disposed to overlap a portion of the heat sink and a portion of the wiring structure in the first direction,
• the mold film is spaced apart from an upper surface of the lower semiconductor device and the upper surface of the lower semiconductor device is in contact with the heat sink,
• a heat radiation pad comprising a metal material in a space between the lower semiconductor device and heat sink, and
• an upper end and a lower end of the heat radiation pad are in contact with the heat sink and the lower semiconductor device, respectively.