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US 2026/0018488 A1Published application
Integrated circuit device having a two-phase thermal management device
AssigneeQUALCOMM Incorporated
InventorsLe GAO, Youmin YU, Nader NIKFAR
Life of this patent
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Abstract
Various aspects of the present disclosure generally relate to an integrated circuit device, such as a packaged integrated circuit device. In some aspects, an integrated circuit device includes a semiconductor die and a lid thermally coupled to the semiconductor die. The lid includes a two-phase thermal management device. The integrated circuit device also includes an interface layer in contact with the semiconductor die and the lid.
Claims20
A packaged integrated circuit device comprising:
- a semiconductor die;
- a lid thermally coupled to the semiconductor die, the lid including a two-phase thermal management device;
- and
- an interface layer in contact with the semiconductor die and the lid.
1 more element
A device comprising:
- a packaged integrated circuit device including:
- a semiconductor die;
- a lid thermally coupled to the semiconductor die, the lid including a two-phase thermal management device;
- and
- an interface layer between the semiconductor die and the two-phase thermal management device.
2 more elements
A method of fabricating a packaged integrated circuit device, the method comprising:
- thermally coupling a lid including a two-phase thermal management device to a semiconductor die via an interface layer positioned between the semiconductor die and the two-phase thermal management device;
- and
- coupling the lid to a package substrate, wherein the semiconductor die is coupled to the package substrate.
Dependencies are inferred from the claim text.