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US 2026/0018486 A1Published application
Near hermetic thermal radio frequency packaging devices, and fabrication methods thereof
AssigneeQorvo US, Inc.
InventorsMD Hasnine, Matthew Essar, Walid Meliane
Life of this patent
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Abstract
The present disclosure provides a packaging device and a method to form the packaging device. The packaging device includes a package base, a die structure disposed over the package base, and a package lid over the die structure. The package lid is thermally coupled with the die structure and the package base.
Claims20
A packaging device, comprising:
- a package base;
- a die structure disposed over the package base;
- and
- a package lid over the die structure, and thermally coupled with the die structure and the package base.
1 more element
A method for forming a packaging device, comprising:
- forming a die structure;
- forming a package base;
- forming a package lid;
- bonding the die structure onto the package base;
- and
- bonding the package lid onto the package base and the die structure.
3 more elements
Dependencies are inferred from the claim text.