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US 2026/0018480 A1Published application
Double-sided molded high-power rf system in package - thermal solution
AssigneeQorvo US, Inc.
InventorsMD Hasnine, Charles E. Carpenter, Thomas Scott Morris
Life of this patent
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Abstract
Systems and methods are disclosed herein to enable top-side and/or bottom-side cooling for double-sided molded (DSM) packages, thereby providing an enhanced thermal pathway to the ambient environment for densely packed DSM packages.
Claims20
A double-sided molded (DSM) package comprising:
- a substrate;
- a first semiconductor die having a front side and a back side, the front side of the first semiconductor die electrically and mechanically attached to a top side of the substrate;
- a top-side heat spreader on the back side of the first semiconductor die;
- a top mold compound that encapsulates the first semiconductor die and the top-side heat spreader, wherein a back side surface of the top-side heat spreader is exposed through the top mold compound;
- a continuous heat spreader on a top surface of the mold compound such that the continuous heat spreader is in thermal contact with the back-side surface of the top-side heat spreader exposed through the top mold compound;
- and
- a second semiconductor die having a front side and a backside, the front side of the second semiconductor die electrically and mechanically attached to a bottom-side of the substrate.
4 more elements
A method for fabricating a double-sided molded (DSM) package, the method comprising:
- attaching a first semiconductor die to a top-side of a substrate, the first semiconductor die having a front side and a back side wherein the front-side of the first semiconductor die is electrically and mechanically attached to the top-side of the substrate;
- attaching a top-side heat spreader on the back side of the first semiconductor die;
- applying a top mold compound over the top surface of the substrate such that the top-side mold compound encapsulates the first semiconductor die and the top-side heat spreader;
- performing top-side co-grinding such that a back side surface of the top-side heat spreader is exposed through the top mold compound;
- forming a continuous heat spreader on a top surface of the mold compound such that the continuous heat spreader is in thermal contact with the back-side surface of the top-side heat spreader exposed through the top mold compound;
- and
- attaching a second semiconductor die to a bottom-side of the substrate, the second semiconductor die having a front side and a backside wherein the front side of the second semiconductor die is electrically and mechanically attached to a bottom-side of the substrate.
4 more elements
Dependencies are inferred from the claim text.