Electronic device and manufacturing method thereof and package structure

A manufacturing method of an electronic device, comprising:

• providing a first semiconductor component and a second semiconductor component, the first semiconductor component adjacent to the second semiconductor component;
• forming an encapsulation layer to surround the first semiconductor component and the second semiconductor component, the encapsulation layer having a first side;
• and
• forming a circuit layer on the first side of the encapsulation layer,
• wherein, the encapsulation layer has a first thickness, the first semiconductor component has a second thickness, the first thickness is greater than the second thickness, and a difference between the first thickness and the second thickness is greater than half of the first thickness and less than three times the second thickness;
• wherein, in a top view, the encapsulation layer has a first area, the first semiconductor component has a second area, the second semiconductor component has a third area, and a sum of the second area and the third area is greater than half of the first area.

A package structure, comprising:

• a first semiconductor component;
• a second semiconductor component, adjacent to the first semiconductor component;
• and
• an encapsulation layer, surrounding the first semiconductor component and the second semiconductor component;
• wherein, the encapsulation layer has a first thickness, the first semiconductor component has a second thickness, the first thickness is greater than the second thickness, a difference between the first thickness and the second thickness is greater than half of the first thickness and smaller than three times the second thickness;
• wherein, in a top view, the encapsulation layer has a first area, the first semiconductor component has a second area, the second semiconductor component has a third area, and a sum of the second area and the third area is greater than half of the first area.