Semiconductor module

Abstract

A semiconductor module includes a plate-shaped base made of metal, and a frame-shaped housing made of a resin composition, the housing having an adhering portion adhering to an outer peripheral portion of the base, wherein in plan view, an outer periphery of the housing includes first sides facing each other and second sides facing each other, a portion of the housing corresponding to each of the second sides is provided with at least one hole for screwing a heat dissipating member, the adhering portion includes a plate-shaped first adhering portion extending along each of the first sides, in plan view, the first adhering portion overlaps an outer periphery of the base, and inequality T1<0.42×L12 is satisfied, when T1 is T1 meters that denote a thickness of the first adhering portion, and L1 is L1 meters that denote a length of the first adhering portion.

Dependencies are inferred from the claim text.