Workpiece Processing System with Multiple Beam Angles

A workpiece processing system, comprising:

• a workpiece holder;
• and
• an ion source chamber, comprising:
• a plasma source;
• a plurality of chamber walls;
• an extraction plate with a first extraction aperture and a second extraction aperture;
• a first blocker disposed within the ion source chamber and proximate the first extraction aperture;
• and
• a second blocker disposed within the ion source chamber and proximate the second extraction aperture;
• wherein each blocker modifies a plasma sheath inside the ion source chamber proximate its respective extraction aperture so as to create two beamlets exiting from its respective extraction aperture, each beamlet having an extraction angle;
• and wherein the first blocker is positioned differently relative to the first extraction aperture than the second blocker is positioned relative to the second extraction aperture such that beamlets extracted from the first extraction aperture and second extraction aperture have different extraction angles.

A workpiece processing system, comprising:

• a workpiece holder;
• and
• an ion source chamber, comprising:
• a plasma source;
• a plurality of chamber walls;
• an extraction plate with a first extraction aperture and a second extraction aperture;
• a first blocker disposed within the ion source chamber and proximate the first extraction aperture;
• and
• a second blocker disposed within the ion source chamber and proximate the second extraction aperture;
• wherein each blocker modifies a plasma sheath inside the ion source chamber proximate its respective extraction aperture so as to create two beamlets exiting from its respective extraction aperture, each beamlet having an extraction angle;
• and wherein the first blocker and the second blocker are electrically biased at different voltages such that beamlets extracted from the first extraction aperture and second extraction aperture have different extraction angles.