Multilayer ceramic electronic component and method of manufacturing the same

A method of manufacturing a multilayer ceramic electronic component, comprising:

• preparing an element body in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked in a first direction, an element body having a pair of end surfaces on which the plurality of internal electrodes are alternately exposed, the pair of end surfaces facing each other in a second direction, an upper surface and a lower surface facing each other in the first direction, and a pair of side surfaces on which the plurality of internal electrodes are exposed, the pair of side surfaces facing each other;
• sticking a pair of side dielectric layers to the pair of side surfaces;
• bending a part of at least one of the side dielectric layers so as to cover a first portion and not to cover a second portion, the first portion being an end in the second direction of at least one surface of the upper surface and the lower surface and being adjacent to a corresponding side surface, the second portion being a central portion in the second direction of the at least one surface of the upper surface and the lower surface and being adjacent to the corresponding side surface;
• and
• forming a pair of external electrodes that cover the pair of end surfaces, respectively.