US 2026/0016754 A1 · RESIST FILM FORMING METHOD, RESIST FILM FORMING DEVICE, AND RECORDING MEDIUM

Abstract

A resist film forming method includes forming a resist film on a substrate by supplying a resist component-containing gas into a processing space inside a processing vessel set into a second atmosphere, the second atmosphere being set in an adjustment area including the processing space of the processing vessel storing the substrate, and the second atmosphere having an oxygen concentration and a humidity lower than those of a first atmosphere at an outside of the adjustment area and a pressure substantially equal to a pressure of the outside; and heating, in the processing space set into the second atmosphere, the substrate with the resist film formed thereon before being subjected to exposure.

Claims20

Dependent claims

A resist film forming method, comprising:

forming a resist film on a substrate by supplying a resist component-containing gas into a processing space inside a processing vessel set into a second atmosphere, the second atmosphere being set in an adjustment area including the processing space of the processing vessel storing the substrate, and the second atmosphere having an oxygen concentration and a humidity lower than those of a first atmosphere at an outside of the adjustment area and a pressure substantially equal to a pressure of the outside;
and
heating, in the processing space set into the second atmosphere, the substrate with the resist film formed thereon before being subjected to exposure.

A resist film forming device, comprising:

a processing vessel for storing a substrate;
an atmosphere adjuster configured to set an adjustment area including a processing space inside the processing vessel into a second atmosphere, the second atmosphere having an oxygen concentration and a humidity lower than those of a first atmosphere at an outside of the adjustment area and a pressure substantially equal to a pressure of the outside;
a gas supply configured to supply a resist component-containing gas to the processing space which is under the second atmosphere to form a resist film on the substrate;
and
a heater configured to heat the substrate with the resist film formed thereon before being subjected to exposure, in the processing space set into the second atmosphere.

2 more elements

Dependencies are inferred from the claim text.

Resist film forming method, resist film forming device, and recording medium

Life of this patent

Resist film forming method, resist film forming device, and recording medium

Life of this patent

Abstract

Claims20