Optical scanner, laser detection system, and vehicle
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsHSIU-WEI KUO, Yu-Ting Liao
Life of this patent
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Abstract
Embodiments of the present disclosure relates to an optical scanner, a laser detection system and a vehicle. The optical scanner includes a substrate, an integrated circuit (IC), an optical phased array (OPA), a wave plate and a beam splitter. The IC is mounted on the substrate. The OPA is flip - chip soldered on a surface of the IC away from the substrate and is electrically connected with the IC. The wave plate is affixed on a side of the OPA away from the IC. The beam splitter is affixed on a side of the wave plate away from the OPA. Projections of the IC, the OPA, the wave plate and the beam splitter on the substrate all have overlapping potions.
Claims17
An optical scanner, comprising:
- a substrate;
- an integrated circuit (IC) mounted on the substrate;
- an optical phased array (OPA) flip -chip soldered onto a surface of the IC away from the substrate, such that the OPA is electrically connected to the IC;
- a wave plate affixed to a side of the OPA away from the IC;
- and
- a beam splitter affixed to a side of the wave plate away from the OPA;
- wherein projections of the IC, the OPA, the wave plate, and the beam splitter on the substrate all have overlapping potions.
A laser detection system, comprising:
- a laser emission device comprising a laser light source for emitting a source light and an optical scanner for converting the source light into a reference light to be emitted to a target to be measured;
- and a laser reception device for receiving a detection light reflected from the target according to the
- reference light and obtaining position information of the target according to the detection light;
- wherein the optical scanner comprises:
- a substrate;
- an integrated circuit (IC) mounted on the substrate;
- an optical phased array (OPA) flip -chip soldered onto a surface of the IC away from the substrate, such that the OPA is electrically connected to the IC;
- a wave plate affixed to a side of the OPA away from the IC;
- and a beam splitter affixed to a side of the wave plate away from the OPA;
- wherein projections of the IC, the OPA, the wave plate, and the beam splitter on the substrate all have overlapping potions.
A vehicle, comprising:
- a vehicle body;
- and
- a laser detection system mounted on the vehicle body and configured to detect whether there is a target to be measured in a travel path of the vehicle body, and when there is the target, obtain a distance information of the target;
- the laser detection system comprising a laser emission device and a laser reception device, the laser emission device comprising a laser light source for emitting a source light and an optical scanner for converting the source light into a reference light to be emitted to the target, the laser reception device being configured to receive a detection light reflected from the target according to the reference light and obtain position information of the target according to the detection light;
- wherein the optical scanner comprises:
- a substrate;
- an integrated circuit (IC) mounted on the substrate;
- an optical phased array (OPA) flip -chip soldered onto a surface of the IC away from the substrate, such that the OPA is electrically connected to the IC;
- a wave plate affixed to a side of the OPA away from the IC;
- and a beam splitter affixed to a side of the wave plate away from the OPA;
- wherein projections of the IC, the OPA, the wave plate, and the beam splitter on the substrate all have overlapping potions.
Dependencies are inferred from the claim text.