Low loss optical interposer
AssigneePsiquantum, Corp.
InventorsGabriel Joel Mendoza, Khanh Tran, Wenguang Li, Vimal Kamineni, Mark Thompson
Life of this patent
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Abstract
An optical interposer can be formed from multiple wafers, including a photonic integrated circuit wafer and an interposer wafer. The photonic integrated circuit wafer can be bonded to a rigid carrier structure, and material near waveguides can be removed such that the waveguides can be coupled to waveguides of the interposer. The photonic integrated circuit can be separated into multiple rigid dies which can be bonded to the interposer separately. Additional processing can be performed to form electrical connections to the rigid dies to form an ultra-low optical interposer.
Claims21
-2. (canceled)
A method comprising:
- forming a bonding layer on a photonic integrated circuit (PIC) wafer, the PIC wafer comprising a substrate layer and a PIC waveguide layer;
- bonding a carrier wafer to the bonding layer of the PIC wafer to form a bonded wafer;
- removing at least a portion of the substrate layer from the bonded wafer;
- singulating the bonded wafer to form a plurality of carrier PIC chips;
- positioning at least one carrier PIC chip of the plurality of carrier PIC chips on an interposer wafer, the interposer wafer comprising an interposer substrate layer and an interposer waveguide layer on the interposer substrate layer, to align one or more waveguides of the PIC waveguide layer with one or more waveguides of the interposer waveguide layer;
- bonding the at least one of the plurality of carrier PIC chips to the interposer wafer to form a PIC chip interposer structure;
- and
- removing at least a portion of the carrier wafer from the PIC chip interposer structure.
A PIC chip optical interposer structure comprising:
- an interposer substrate layer;
- an interposer waveguide layer disposed on the interposer substrate layer;
- and
- one or more photonic integrated circuit (PIC) chips bonded to the interposer waveguide layer, each PIC chip comprising a PIC waveguide layer having one or more PIC waveguides aligned and optically coupled to one or more waveguides of the interposer waveguide layer;
- wherein the one or more PIC chips are formed by:
- singulation of a bonded wafer comprising a carrier wafer bonded to a PIC wafer;
- and
- removal of at least a portion of a substrate layer of the PIC wafer;
- and
- wherein at least a portion of the carrier wafer is removed after the one or more PIC chips are bonded to the interposer waveguide layer.
A system comprising:
- an optical interposer including an interposer substrate layer and an interposer waveguide layer disposed on the interposer substrate layer, the interposer waveguide layer comprising a plurality of interposer waveguides;
- one or more photonic integrated circuit (PIC) chips bonded to the interposer waveguide layer, each PIC chip comprising a PIC waveguide layer having one or more PIC waveguides aligned and optically coupled to one or more waveguides of the interposer waveguide layer;
- at least one electronic integrated circuit (EIC) chip electrically connected to at least one of the PIC chips;
- an optical interface configured to couple light between the interposer waveguide layer and an external optical fiber or optical device;
- and
- an electrical interface configured to transmit electrical signals between the EIC chip and an external electrical device.
Dependencies are inferred from the claim text.