Test interconnect with conductive planes and components for power integrity and thermal management
AssigneeEssai, Inc.
InventorsJames HASTINGS, Quaid Joher FURNITUREWALA, Rolf NEUWEILER, Juergen SERRER, Joe XIAO
Life of this patent
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Abstract
Test interconnect systems and methods are described. In one example, a test interconnect includes a housing structure that houses at least a portion of one or more compressible probes. The test interconnect also includes a plate that retains the one or more compressible probes relative to a load board, and a circuit board with one or more conductive planes that provide a conductive path for a supply voltage for a device under test. The circuit board is positioned on a side of the housing structure relative to a device under test that is opposite the load board side.
Claims20
A test interconnect comprising:
- a housing structure that houses at least a portion of one or more compressible probes;
- a plate on a first surface of the housing structure, wherein the plate retains the one or more compressible probes for connection to a load board;
- and
- a circuit board on a second surface of the housing structure opposite the first surface, the circuit board comprising one or more conductive planes that provide a conductive path for a supply voltage for a device under test (DUT), wherein the test interconnect is configured to interface with the DUT closer to the second surface of the housing structure than the first surface of the housing structure.
A system comprising:
- a load board comprising one or more load board contacts;
- a test interconnect assembly located between the load board and a device under test (DUT) interface of the test interconnect assembly, the test interconnect assembly comprising:
- a housing structure that houses at least a portion of one or more compressible probes;
- a plate on a first surface of the housing structure closer to the load board than the DUT, wherein the plate retains the one or more compressible probes;
- and
- a circuit board on a second surface of the housing structure closer to the DUT interface than the load board, the circuit board comprising one or more conductive planes that provide a conductive path for a supply voltage.
A method comprising:
- providing a test interconnect assembly comprising a device under test (DUT) interface;
- housing, using a housing structure of the test interconnect assembly, at least a portion of one or more compressible probes;
- attaching a plate of the test interconnect assembly on a first surface of the housing structure, wherein the plate retains the one or more compressible probes;
- attaching a circuit board on a second surface of the housing structure, the circuit board comprising one or more conductive planes that provide a conductive path for a supply voltage;
- and
- connecting a load board to the plate of the of the test interconnect assembly, the load board comprising load board contacts;
- wherein the test interconnect assembly is configured to connect to a DUT closer to the circuit board than the load board, the DUT comprising one or more DUT contacts.
Dependencies are inferred from the claim text.