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US 2026/0015532 A1Published application
Low-density potting adhesive
Assignee3M Innovative Properties Company
InventorsSohaib Elgimiabi, Cyrus S. Manzo
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Abstract
The present disclosure provides a curable lightweight potting adhesive composition precursor, comprising a first part (A) comprising (i) at least one first epoxy curing agent: (ii) at least one first curing aid comprising at least one ammonium salt: (iii) at least one second curing aid selected from tertiary amines: (iv) optionally, hollow microspheres: a second part (B) comprising (i) at least one epoxy resin; and (ii) optionally, hollow microspheres.
Claims15
A curable lightweight potting adhesive composition precursor, comprising a first part (A) comprising
- (i) at least one first epoxy curing agent;
- (ii) at least one first curing aid comprising at least one ammonium salt;
- (iii) at least one second curing aid selected from tertiary amines;
- (iv) optionally, hollow microspheres;
- a second part (B) comprising
- (i) at least one epoxy resin;
- and
- (ii) optionally, hollow microspheres.
5 more elements
Dependencies are inferred from the claim text.