Substrate processing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsIm Bi Yeo, Dong Hoon Kwon
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus is provided. The substrate processing apparatus includes a chamber, a brush within the chamber, a driver configured to rotate the brush, an injector configured to inject a coating material onto a surface of the brush when the brush is rotated, a thickness adjuster configured to adjust a thickness of the coating material on the brush when the brush is rotated, and a curing device configured to cure the coating material having an adjusted thickness on the brush.
Claims20
A substrate processing apparatus comprising:
- a chamber;
- a brush within the chamber;
- a driver configured to rotate the brush;
- an injector configured to inject a coating material onto a surface of the brush when the brush is rotated;
- a thickness adjuster configured to adjust a thickness of the coating material on the surface of the brush when the brush is rotated;
- and
- a curing device configured to cure the coating material having an adjusted thickness on the brush.
A substrate processing apparatus comprising:
- a chamber comprising a first area, a second area, and a third area, the second area residing between the first area and the third area;
- a first brush within the chamber;
- a first driver configured to rotate the first brush and move the first brush between the first area and the second area;
- a second brush within the chamber;
- a second driver configured to rotate the second brush and move the second brush between the second area and the third area;
- a first brush coating apparatus residing in the first area, the first brush coating apparatus comprising:
- a first injector configured to inject a first coating material onto a surface of the first brush when the first brush is rotated,
- a first thickness adjuster configured to adjust a thickness of the coating material injected on the surface of the first brush when the first brush is rotated, and
- a first curing device configured to cure the coating material with an adjusted thickness on the first brush;
- a second brush coating apparatus residing in the third area, the second brush coating apparatus comprising:
- a second injector configured to inject a second coating material onto a surface of the second brush when the second brush is rotated,
- a second thickness adjuster configured to adjust a thickness of the second coating material on the second brush when the second brush is rotated, and
- a second curing device configured to cure the second coating material with an adjusted thickness on the second brush;
- and
- a controller configured to control the first driver, the second driver, the first brush coating apparatus, and the second brush coating apparatus.
A substrate processing apparatus comprising:
- a chamber;
- a brush within the chamber;
- a driver configured to rotate the brush;
- an injector configured to inject a coating material onto a surface of the brush when the brush is rotated;
- a thickness adjuster configured to adjust a thickness of the coating material on the surface of the brush when the brush is rotated;
- a curing device configured to cure the coating material with an adjusted thickness on the brush;
- a recovery tank positioned below the brush and configured to recover the coating material injected onto the brush;
- a purifier connected to the recovery tank and configured to purify the recovered coating material;
- a contaminant discharge pipe connected to the purifier and configured to discharge contaminants filtered from the recovered coating material to an outside of the chamber;
- a supply pipe connected to the purifier and configured to re-supply the coating material purified by the purifier to the injector;
- a sensor positioned on an upper portion of the brush and configured to measure a thickness of the coating material cured on the brush;
- and
- a controller configured to receive information with respect to the thickness of the coating material from the sensor.
Dependencies are inferred from the claim text.