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US 2026/0011698 A1Published application
Electronic structure, electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsJui-Cheng LIN, Chi-Ching HO, Chao-Chiang PU, Yi-Min FU, Chiu-Ling CHEN
Life of this patent
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Abstract
An electronic structure, an electronic package and a manufacturing method thereof are provided, in which a carrier and an adhesive layer are used to support or fix the electronic structure and the electronic package, and double carriers are used to support or fix the electronic structure and the electronic package, thereby avoiding the warpage problem of the electronic structure and the electronic package.
Claims14
An electronic structure, comprising:
- a package module defined with a wiring section and a component section disposed on the wiring section, wherein the wiring section has a first side and a second side opposite to the first side and includes a first electronic component and a redistribution layer, wherein the component section has a first side and a second side opposite to the first side and includes a second electronic component, and the second side of the component section is disposed on the first side of the wiring section, and wherein, at the same time, the redistribution layer is electrically connected to the first electronic component and the second electronic component;
- and
- a component-side carrier having a first side and a second side opposite to the first side, wherein the second side of the component-side carrier is coupled to on the first side of the component section.
An electronic package, comprising:
- a package module defined with a wiring section and a component section disposed on the wiring section, wherein the wiring section has a first side and a second side opposite to the first side and includes a first electronic component and a redistribution layer, wherein the component section has a first side and a second side opposite to the first side and includes a second electronic component, and the second side of the component section is coupled to on the first side of the wiring section, and wherein, at the same time, the redistribution layer is electrically connected to the first electronic component and the second electronic component;
- conductive bumps disposed on the second side of the wiring section;
- and
- an adhesive layer formed on the second side of the wiring section to cover the conductive bumps.
1 more element
A method for manufacturing an electronic package, comprising:
- providing a wiring-side carrier and a package module, wherein the package module is defined a wiring section and a component section, each of the wiring-side carrier, the wiring section, and the component section has a first side and a second side opposite to the first side, and the second side of the component section is coupled to the first side of the wiring section;
- disposing the package module on the first side of the wiring-side carrier via the second side of the wiring section;
- and
- disposing a component-side carrier having a first side and a second side opposite to the first side on the first side of the component section via the second side of the component-side carrier.
1 more element
Dependencies are inferred from the claim text.