Method for Collective Dishing of Singulated Dies

A method of substrate processing, comprising:

• attaching a plurality of dies face down to a first carrier, and wherein the plurality of dies are spaced horizontally from one another on the first carrier;
• filling spaces between the plurality of dies and covering backs sides of the plurality of dies with a dielectric or metal;
• grinding or polishing the dielectric or metal covering the back sides of the plurality of dies and grinding or polishing the back sides of the plurality of dies until the back sides are exposed and the plurality of dies have a substantially uniform thickness;
• after grinding or polishing, attaching a second carrier to the back sides of the plurality of dies and detaching the first carrier exposing the die faces of the plurality of dies;
• dishing the die faces of the plurality of dies to a desired dishing profile;
• and
• after dishing the die faces, removing the dielectric or metal between at least one space between the plurality of dies.

A method of substrate processing, comprising:

• attaching a plurality of dies face up to a first carrier, and wherein the plurality of dies are spaced horizontally from one another on the first carrier;
• filling spaces between the plurality of dies and covering faces of the plurality of dies with a dielectric or metal;
• grinding or polishing the dielectric or metal covering the die faces of the plurality of dies and grinding or polishing the die faces of the plurality of dies until the die faces are exposed and all of the dies have a substantially uniform thickness;
• after grinding or polishing, dishing the die faces of the plurality of dies to a desired dishing profile;
• and
• after dishing the die faces, removing the dielectric or metal between at least one space between the plurality of dies.