Chiplet Hub with Stacked HBM

A chiplet hub for use with a high bandwidth memory (HBM) and a substrate, the HBM having sides and two faces, a first face including connections for mating with the chiplet hub, the HBM including an HBM stack and a JEDEC base die connected to the HBM stack, the JEDEC base die including an HBM PHY, the HBM not having any chiplet connection sites, the chiplet hub comprising:

• a die having two faces and at least three sides, the die including:
• a die HBM PHY to cooperate with JEDEC base die HBM PHY;
• a plurality of memory controllers connected to the die HBM PHY;
• chiplet connection sites for connection of at least one child chiplet on each of the at least three sides;
• connections on a first face for receiving the HBM;
• and
• connections on a second face for mating with the substrate.

A chiplet hub for use with a high bandwidth memory (HBM) and a substrate, the HBM having sides and two faces, a first face including connections for mating with the chiplet hub, the HBM including an HBM stack but not including a base die connected to the HBM stack, the HBM not having any chiplet connection sites, the chiplet hub comprising:

• a die having two faces and at least three sides, the die including:
• a vendor buffer to cooperate with HBM stack;
• a plurality of memory controllers connected to the vendor buffer;
• chiplet connection sites for connection of at least one child chiplet on each of the at least three sides;
• connections on a first face for receiving the HBM stack;
• and
• connections on a second face for mating with the substrate.