High die stack package with modular structure

A die stack package, comprising:

• an interposer;
• a plurality of first die stacks carried by the interposer, wherein the first die stacks are stacked on top of one another;
• a plurality of second die stacks carried by the interposer, wherein the second die stacks are stacked on top of one another;
• and
• a modular structure carried by the interposer, wherein the modular structure extends into spaces between the plurality of first die stacks and the plurality of second die stacks, wherein the modular structure includes conducting elements electrically coupled to each of the first die stacks, each of the second die stacks, and the interposer.

A method for manufacturing a die stack package, the method comprising:

• assembling a proximal unit, wherein assembling the proximal unit comprises:
• attaching first and second proximal die stacks on a substrate;
• attaching a proximal portion of a modular structure on the substrate and between the first and second proximal die stacks;
• and
• electrically coupling each of the first and second proximal die stacks to conducting elements of the proximal portion of the modular structure;
• and
• assembling a distal unit, wherein assembling the distal unit comprises:
• stacking first and second distal die stacks on the first and second proximal die stacks, respectively;
• stacking a distal portion of the modular structure on the proximal portion of the modular structure and between the first and second distal die stacks;
• and
• electrically coupling each of the first and second distal die stacks to conducting elements of the distal portion of the modular structure.