Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer

A non-transitory computer-readable medium that stores a set of instructions that is executable by one or more processors of a system to cause the system to perform operations comprising:

• undocking a stage comprising an electrostatic chuck to enable an inspection process of a wafer;
• generating measurement data based on interactions between the wafer and a plurality of first components implemented at the electrostatic chuck;
• determining, based on the generated measurement data, electric characteristics associated with interfaces between the wafer and the electrostatic chuck;
• and
• providing, to an electrostatic chuck control system, based on the determined electric characteristics, and by a controller, first signals to enable adjusting at least some of the plurality of first components while the stage is undocked.

A system configured to inspect a wafer, comprising:

• an inspection system configured to manipulate an electron beam for scanning the wafer during an inspection process;
• a stage configured to be undocked during the inspection process;
• an electrostatic chuck coupled to the stage, wherein the electrostatic chuck comprises a plurality of components configured to influence an interaction between the wafer and the electrostatic chuck during the inspection process;
• a first sensor configured to generate measurement data between at least some of the plurality of components and the wafer;
• and
• a controller including circuitry and configured to receive the measurement data to determine electric characteristics associated with interfaces between the wafer and the electrostatic chuck and to generate adjustment data to enable adjusting, while the stage is undocked, at least some of the plurality of components based on the determined electric characteristics.

A system comprising:

• one or more processors;
• and
• one or more memories that stores a set of instructions that is executable by the one or more processors to cause the system to perform operations comprising:
• undocking a stage comprising an electrostatic chuck to enable an inspection process of a wafer;
• generating measurement data based on interactions between the wafer and a plurality of first components implemented at the electrostatic chuck;
• determining, based on the generated measurement data, electric characteristics associated with interfaces between the wafer and the electrostatic chuck;
• and
• providing, to an electrostatic chuck control system, based on the determined electric characteristics, and by a controller, first signals to enable adjusting at least some of the plurality of first components while the stage is undocked.