Board Inspection System and Board Inspection Method
AssigneeShimadzu Corporation
InventorKazuki KANAMOTO
Life of this patent
Estimating the term…
Abstract
A board inspection system according to this invention includes an X-ray imaging apparatus performing X-ray imaging of a board on which a solder ball is placed; and a board inspection apparatus including an inspection apparatus controller generating an X-ray image of the board, wherein the inspection apparatus controller generates a determination image based on the X-ray image of the board, and determines whether a shape of the solder ball is proper or improper based on a plurality of distances from a center of gravity G of a solder ball area to a plurality of outer edge parts of the solder ball area in the determination image.
Claims18
A board inspection system comprising:
- an X-ray imaging apparatus performing X-ray imaging of a board on which a solder ball is placed;
- and
- an inspection apparatus including a controller generating an X-ray image of the board captured by the X-ray imaging through the X-ray imaging apparatus, wherein
- the controller generates a determination image based on the X-ray image of the board captured by the X-ray imaging through the X-ray imaging apparatus, and determines whether a shape of the solder ball is proper or improper based on a plurality of distances from a center of gravity of a solder ball area to a plurality of outer edge parts of the solder ball area in the determination image.
A board inspection method comprising:
- an imaging step performing X-ray imaging of a board on which a solder ball is placed;
- an X-ray image generation step of generating an X-ray image of the board captured by the X-ray imaging;
- a determination-image generation step of generating a determination image based on the X-ray image;
- and
- a determination step of determining whether a shape of the solder ball is proper or improper based on a plurality of distances from a center of gravity of a solder ball area to a plurality of outer edge parts of the solder ball area in the determination image.
Dependencies are inferred from the claim text.