Pattern forming method
AssigneeFUJIFILM Corporation
InventorsTakashi NAKAMURA, Tetsuya KAMIMURA, Satomi TAKAHASHI
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AssigneeFUJIFILM Corporation
InventorsTakashi NAKAMURA, Tetsuya KAMIMURA, Satomi TAKAHASHI
Estimating the term…
A pattern forming method including a pre-wetting step of coating a substrate with a chemical liquid so as to obtain a pre-wetted substrate; a resist film forming step of forming a resist film on the pre-wetted substrate by using an actinic ray-sensitive or radiation-sensitive resin composition; an exposure step of exposing the resist film; and a development step of developing the exposed resist film by using a developer, wherein the chemical liquid of the present invention contains a mixture of two or more kinds of designated organic solvents, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains a resin including at least one kind of repeating unit selected from the group consisting of a repeating unit represented by Formula (a), a repeating unit represented by Formula (b), a repeating unit represented by Formula (c), a repeating unit represented by Formula (d), and a repeating unit represented by Formula (e).
A pattern forming method comprising:
Dependencies are inferred from the claim text.