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AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakashi SAWAMURA, Tomohiro IMATA, Satoshi MATSUBARA
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A composition for forming an organic film, containing: resin and/or compound (A) for forming organic film; polymer (B) not containing halogen atom and containing repeating unit represented by following formula (1) and repeating unit represented by following formula (1′); and solvent (C), where R2 and R3 independently represent saturated or unsaturated organic group having 1-20 carbon atoms and optionally having substituent, and “y” and “z” independently satisfy 0<y<1 and 0<z<1, wherein y+z=1. This can provide composition for forming organic film making it possible to form film excellent in coating property wherein coating defects, as pinholes on substrate (wafer), film-formability (in-plane uniformity), and filling property, composition not containing fluorine atom and containing particular polymer. Furthermore, the invention can provide method for forming organic film using composition for forming organic film, patterning process using composition for forming organic film, and polymer.
A composition for forming an organic film, comprising:
A method for manufacturing a polymer not containing a halogen atom and containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (1′), the method comprising ring-opening polymerization of an oxetane-ring-containing compound represented by the following formula (4), using a Lewis acid cationic polymerization catalyst and tetrahydrofuran,
A polymer for a composition for forming an organic film, the polymer not containing a halogen atom and containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (1′),
Dependencies are inferred from the claim text.