Solder material with contrast agent
OwnerAdam Klett, James Franklin Perigeninventors
Life of this patent
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Abstract
An electrical connection material having a contrast agent infused within, and related systems and methods of detection thereof, are disclosed herein. Computer electronics such as printed circuit boards have electronic components attached to a substrate by an electrical connection material. The electrical connection material has at least one component infused with a contrast agent. The contrast agent is of a concentration to provide a visual distinction or highlight when imaged by an inspection system, such as an x-ray system of computed tomography (CT) scanning system. The presence of the contrast agent demonstrates that not all of residual electrical connection material has been cleaned away from the printed circuit board after manufacture.
Claims19
An electrical connection material for connecting an electrical component to a substrate, the electrical connection material comprising:
- a solder material including at least one component selected from the group of solder wire, solder paste, solder resin, and solder flux;
- wherein the at least one component includes a contrast agent, wherein the concentration of contrast agent within the at least one component of the solder material is sufficient to be visually distinct when the electrical connection material is imaged by an imaging device.
A system for inspecting a substrate for residue beneath an electrical component, comprising:
- an electrical connection material comprising a solder material including at least component selected from the group of solder wire, solder paste, solder resin, and solder flux, wherein the at least one component of the solder material is infused with a contrast agent, the electrical connection material being applicable to the substrate for connecting the electrical component to the substrate;
- and
- an inspection system operable to generate one or more images of the substrate including the connected electrical component, wherein the residue is highlighted in the one or more images of the substrate due to the contrast agent.
A method for inspecting a substrate for residue, comprising:
- Applying an electrical connection material to a printed circuit board, the electrical connection material having a solder material including at least one component selected from a group consisting of solder wire, solder paste, solder resin, and solder flux, wherein the at least one component of the solder material is infused with a contrast agent;
- placing an electrical component in contact with the electrical connection material;
- heating the solder material to connect the electrical component to the printed circuit board;
- scanning the substrate with an inspection system to generate one or more images of the printed circuit board;
- and
- analyzing the one or more images of the substrate for residue, wherein the residue is highlighted in the one or more images of the substrate due to the contrast agent.
Dependencies are inferred from the claim text.