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US 2026/0001995 A1Published application
Polyimide precursor
AssigneePI Advanced Materials Co., Ltd.
InventorsSe Joo PARK, Jung Hoo WE, Joon Chul PARK, Ik Sang LEE
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Abstract
The present application provides a polyimide precursor capable of realizing a polyimide with high adhesive strength, high surface flatness, and good durability in an environmentally friendly manner, a method of preparing the polyimide precursor, and a polyimide film including a cured product of the polyimide precursor.
Claims17
A polyimide precursor comprising:
- a polyamic acid including a dianhydride monomer and a diamine monomer as polymerization units;
- an organic solvent including one or more selected from the group consisting of N,N-diethylacetamide (DEAc), N,N-diethylformamide (DEF), N-ethylpyrrolidone (NEP), (dimethylpropionamide (DMPA), and diethylpropionamide (DEPA);
- a silicon-containing first additive including at least one functional group;
- and
- one or more second additives selected from a phosphorus-based additive having an aromatic ring group and an amine-based additive having an aromatic or heteroaromatic ring group.
2 more elements
A method of preparing a polyimide precursor, comprising:
- a polymerization operation of polymerizing a dianhydride monomer and a diamine monomer in the presence of an organic solvent including one or more selected from the group consisting of N,N-diethylacetamide (DEAc), N,N-diethylformamide (DEF), N-ethylpyrrolidone (NEP), dimethylpropionamide (DMPA), and diethylpropionamide (DEPA) to prepare a polyamic acid;
- and
- a preparation operation of mixing the prepared polyamic acid with a silicon-containing first additive containing at least one functional group and one or more second additives selected from a phosphorus-based additive having an aromatic ring group and an amine-based additive having an aromatic or heteroaromatic ring group to prepare a polyimide precursor.
Dependencies are inferred from the claim text.