Cylindrical grinding device, cylindrical grinding method, and wafer manufacturing method

A cylindrical grinding apparatus configured to produce a monocrystal for slicing by performing cylindrical grinding, in the cylindrical grinding an outer circumferential surface of a monocrystal for grinding being ground while the monocrystal for grinding is rotated around a rotation axis, the cylindrical grinding apparatus comprising:

• an attitude correcting section configured to correct an attitude of the monocrystal for grinding to incline a center axis of the monocrystal for grinding with respect to the rotation axis, by performing a rotation and a turn based on a plane orientation difference between a plane orientation of the monocrystal for grinding and a target plane orientation of a wafer to be obtained by slicing the monocrystal for slicing, in the rotation the monocrystal for grinding being rotated around the center axis, in the turn the monocrystal for grinding being turned around a turn axis orthogonal to the center axis;
• and
• a grinding section configured to cylindrically grind the outer circumferential surface of the monocrystal for grinding while rotating the monocrystal for grinding whose attitude has been corrected around the rotation axis.