Structure and manufacturing method for photo coupler single chip
AssigneeTaiwan-Asia Semiconductor Corporation
InventorsKun-Li Lin, Chuan-Wei Chen, Jun-Ying Lin
Life of this patent
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Abstract
A photo coupler single chip structure and a manufacturing method thereof are provided. The photo coupler single chip structure includes an epitaxial substrate, a light-emitting unit, an electrical insulation layer and a light-receiving unit. The light-emitting unit is disposed on the epitaxial substrate. The electrical insulation layer is disposed on the light-emitting unit. The light-receiving unit is disposed on the electrical insulation layer. The light-emitting unit can form an optical signal in response to an input signal. The light-receiving unit will directly absorb the optical signal through the electrical insulating layer and convert it into an output signal.
Claims13
A photo coupler single chip structure, comprising:
- an epitaxial substrate;
- a light-emitting unit, disposed on the epitaxial substrate;
- an electrical insulation layer, disposed on the light-emitting unit;
- and
- a light-receiving unit, disposed on the electrical insulation layer,
- wherein the light-emitting unit forms an optical signal in response to an input signal, and the optical signal is directly absorbed and converted into an output signal by the light-receiving unit through the electrical insulating layer.
A photo coupler single chip structure, comprising:
- an epitaxial substrate;
- a light-receiving unit, disposed on the epitaxial substrate;
- an electrical insulation layer, disposed on the light-receiving unit;
- and
- a light-emitting unit, disposed on the electrical insulation layer,
- wherein the light-emitting unit forms an optical signal in response to an input signal, and the optical signal is directly absorbed and converted into an output signal by the light-receiving unit through the electrical insulating layer.
A manufacturing method of a photo coupler single chip structure, comprising:
- providing an epitaxial substrate;
- providing a light-emitting unit, disposed on the epitaxial substrate;
- providing an electrical insulation layer, disposed on the light-emitting unit;
- and
- providing a light-receiving unit, disposed on the electrical insulation layer,
- wherein the light-emitting unit forms an optical signal in response to an input signal, and the optical signal is directly absorbed and converted into an output signal by the light-receiving unit through the electrical insulating layer.
Dependencies are inferred from the claim text.