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US 2025/0393128 A1Published application
Triangular board assembly for solid state drive
OwnerJohn Hung, Andrew Morning-Smith +3inventors
InventorsJohn Hung, Andrew Morning-Smith, Kai-Uwe Schmidt, Paul Gwin, Nan Allison Yao
Life of this patent
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Abstract
An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.
Claims21
-20. (canceled)
An apparatus comprising:
- a first board arranged within an enclosure, wherein the first board comprises a first surface, wherein the first surface comprises a first portion, a second portion, and a third portion between the first portion and the second portion, and wherein the first portion, the second portion, and the third portion are substantially equal in size;
- a second board arranged within the enclosure and electrically coupled to the first board, wherein the second board is arranged over the third portion, and wherein the second board is arranged at a first angle that is non-parallel with respect to the first board;
- a third board arranged within the enclosure and electrically coupled to the first board, wherein the third board is arranged over the third portion, and wherein the third is arranged at a second angle that is non-parallel with respect to the first board;
- and
- a structure arranged within the enclosure over the third portion, wherein:
- the structure is not in contact with the first portion and the second portion,
- the structure is not in alignment with the first portion and the second portion when viewed in a direction perpendicular to the first surface of the first board, and
- the structure is in mechanical and thermal communication with respective first sides of each of the first board, the second board, and the third board.
5 more elements
A method for manufacturing an apparatus, the method comprising:
- arranging a first board within an enclosure, wherein the first board comprises a first surface, wherein the first surface comprises a first portion, a second portion, and a third portion between the first portion and the second portion, and wherein the first portion, the second portion, and the third portion are substantially equal in size;
- arranging a second board within the enclosure and electrically coupling the second board to the first board, wherein the second board is arranged over the third portion, and wherein the second board is arranged at a first angle that is non-parallel with respect to the first board;
- arranging a third board within the enclosure and electrically coupling the third board to the first board, wherein the third board is arranged over the third portion, and wherein the third is arranged at a second angle that is non-parallel with respect to the first board;
- and
- arranging a structure within the enclosure over the third portion, wherein:
- the structure is not in contact with the first portion and the second portion,
- the structure is not in alignment with the first portion and the second portion when viewed in a direction perpendicular to the first surface of the first board, and
- the structure is in mechanical and thermal communication with respective first sides of each of the first board, the second board, and the third board.
5 more elements
Dependencies are inferred from the claim text.