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US 2025/0388784 A1Published application
Semiconductor processing tape
AssigneeFurukawa Electric Co., Ltd.
InventorTakumi ASANUMA
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Abstract
A semiconductor processing tape, in which a pressure-sensitive adhesive layer is formed on a substrate film, wherein the substrate film is a cured product of an epoxy compound-containing composition, and a thermal shrinkage ratio after retention under an atmosphere at 260° C. for 10 minutes, of the semiconductor processing tape, is 5.0% or less.
Claims10
A semiconductor processing tape, in which a pressure-sensitive adhesive layer is formed on a substrate film, wherein
- the substrate film is a cured product of an epoxy compound-containing composition, and
- a thermal shrinkage ratio after retention under an atmosphere at 260° C. for 10 minutes, of the semiconductor processing tape, is 5.0% or less.
Dependencies are inferred from the claim text.