# US 2025/0385168 A1 · Localized thinned board for bottom side component integration > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0385168 A1 - Document ID: US20250385168A1 - Status: Published application - Kind: A1 - Application number: 18/745,782 - Filed: 2024-06-17 - Published: 2025-12-18 - Earliest claimed: 2024-06-17 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Min Suet LIM; Chin Lee KUAN; Jeff KU; Pin Jan WANG; Telesphor KAMGAING - Web page: https://patentgrep.com/patent/US20250385168A1 ## CPC - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 70/685: comprising multiple insulating layers - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments disclosed herein include an apparatus with a substrate with a first surface and a second surface. In an embodiment, the substrate comprises a dielectric material. A first region of the substrate has a first metal density, and a second region of the substrate has a second metal density, where the second metal density is lower than the first metal density. In an embodiment, a depression is formed into the first surface of the substrate, where the depression is located at least partially over the second region of the substrate. ## Claims ### Claim 1 An apparatus, comprising: a substrate with a first surface and a second surface, wherein the substrate comprises a dielectric material; a first region of the substrate with a first metal density; a second region of the substrate with a second metal density, wherein the second metal density is lower than the first metal density; and a depression into the first surface of the substrate, wherein the depression is located at least partially over the second region of the substrate. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the depression has tapered sidewalls or vertical sidewalls. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the depression has rounded corners. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the substrate comprises a plurality of layers, and wherein at least one of the plurality of layers has a first thickness over the first region and a second thickness over the second region, wherein the second thickness is smaller than the first thickness. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein a depth of the depression is at least 10 μm. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the depression has a substantially planar surface that is substantially parallel to the second surface. ### Claim 7 (depends on 1) The apparatus of claim 1, further comprising: a component within the depression and coupled to the substrate. ### Claim 8 (depends on 7) The apparatus of claim 7, wherein the component is an electrically passive component. ### Claim 9 (depends on 7) The apparatus of claim 7, further comprising: a die coupled to the second surface of the substrate. ### Claim 10 (depends on 9) The apparatus of claim 9, wherein the component is at least partially within a footprint of the die. ### Claim 11 An apparatus, comprising: a first substrate; a second substrate coupled to the first substrate by an interconnect, wherein a standoff height is provided between the first substrate and the second substrate; a depression with rounded corners in the first substrate; and a component between the first substrate and the second substrate, wherein a thickness of the component is greater than the standoff height, and wherein the component is within a footprint of the depression. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the first substrate is a package substrate, and wherein the second substrate is a board. ### Claim 13 (depends on 11) The apparatus of claim 11, wherein the first substrate is a board, and wherein the second substrate is a package substrate. ### Claim 14 (depends on 11) The apparatus of claim 11, further comprising: a second depression in the second substrate, wherein the component is within the depression and the second depression. ### Claim 15 (depends on 11) The apparatus of claim 11, wherein the first substrate has a first metal density outside of the footprint of the depression and a second metal density within the footprint of the depression, wherein the second metal density is lower than the first metal density. ### Claim 16 (depends on 11) The apparatus of claim 11, wherein sidewalls of the depression are non-linear. ### Claim 17 (depends on 11) The apparatus of claim 11, wherein the component is an electrically passive component. ### Claim 18 An apparatus, comprising: a substrate with a first region and a second region, wherein the substrate comprises a dielectric material; electrically conductive routing within the substrate, wherein the electrically conductive routing within the first region has a first proportion of metal area relative to the dielectric material area, and the electrically conductive routing within the second region has a second proportion of metal area relative to the dielectric material area, and wherein the second proportion is lower than the first proportion; and wherein the first region of the substrate has a first thickness, and the second region of the substrate has a second thickness that is smaller than the first thickness. ### Claim 19 (depends on 18) The apparatus of claim 18, wherein the substrate comprises a plurality of dielectric layers, and wherein a first number of the plurality of dielectric layers in the first region is equal to a second number of the plurality of dielectric layers in the second region. ### Claim 20 (depends on 18) The apparatus of claim 18, wherein the substrate has a first surface and a second surface opposite from the first surface, wherein the first surface is substantially planar, and wherein the second surface comprises a depression.