Semiconductor device

Abstract

A semiconductor device includes a first conductive member having an island portion, a semiconductor element disposed on one side of a thickness direction of the island portion, and a sealing resin covering the semiconductor element and at least a part of the first conductive member. The island portion is located on one side of a first direction perpendicular to the thickness direction and includes a first edge portion extending in a second direction perpendicular to the thickness direction and the first direction. The first edge portion has a first step portion covered by the sealing resin and formed on one side of the second direction with respect to the semiconductor element in the second direction. The first step portion is recessed toward another side in the first direction, on the one side of the second direction rather than on another side of the second direction.

Dependencies are inferred from the claim text.