Sic mosfet semiconductor packages and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsMaria Cristina ESTACIO, Jerome TEYSSEYRE, Elsie Agdon CABAHUG
Life of this patent
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Abstract
A semiconductor package is disclosed. Specific implementations of a semiconductor package may include: one or more semiconductor die coupled between a baseframe and a clip, the baseframe including a gate pad of the baseframe coupled with a gate pad of the one or more semiconductor die, and a source pad of the baseframe coupled with a source pad of the one or more semiconductor die, where the gate pad of the baseframe extends beyond a perimeter of the one or more semiconductor die.
Claims21
1-8. (canceled)
A method of forming a semiconductor package comprising:
- providing a baseframe;
- providing two or more semiconductor die each coupled with one of a heat sink or a clip, the two or more semiconductor die coupled together through a wafer carrier;
- coupling an Ag sinter material on one or more gate pads and one or more source pads of the baseframe;
- pressure sintering one or more gate pads and one or more source pads of one or more semiconductor die with the Ag sinter material;
- molding a mold compound over the baseframe and the two or more semiconductor die;
- and
- grinding away the wafer carrier to expose the heat sink or the clip, the heat sink or the clip each comprising a drain contact.
A method of forming a semiconductor package comprising:
- providing a baseframe;
- providing two or more semiconductor die each coupled with one of a heat sink or a clip, the two or more semiconductor die coupled together through a wafer carrier;
- coupling an Ag sinter material on one or more gate pads and one or more source pads of the baseframe;
- pressure sintering one or more gate pads and one or more source pads of one or more semiconductor die with the Ag sinter material;
- molding a mold compound over the baseframe and the two or more semiconductor die;
- and
- grinding away the wafer carrier to expose the heat sink or the clip, the heat sink or the clip each comprising a drain contact;
- wherein a source pad of the one or more source pads of the baseframe extends towards a corresponding gate pad of the one or more gate pads of the semiconductor die beyond a perimeter of a corresponding source pad of the one or more source pads of the semiconductor die.
A method of forming a semiconductor package comprising:
- providing a baseframe;
- providing two or more semiconductor die each coupled with one of a heat sink or a clip, the two or more semiconductor die coupled together through a wafer carrier;
- coupling a sinter material on one or more gate pads and one or more source pads of the baseframe;
- pressure sintering one or more gate pads and one or more source pads of one or more semiconductor die with the sinter material;
- molding a mold compound over the baseframe and the two or more semiconductor die;
- and
- exposing the heat sink or the clip through the mold compound.
Dependencies are inferred from the claim text.